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Packaged LED architectures advance across types and applications

Today, packaged LED manufacturers offer products specific to most every application you can imagine, and you can choose from high-power, COB, mid-power, CSP, and other options. We have advancements in white and color components, and for that matter in UV and IR...

Osram CEO pushes digital services beyond lighting (UPDATED)

With offers for lamps group “days” away, Olaf Berlien outlines plans to add Internet connectivity and data-centric activities to company’s stable. The original version of this article can be found...

Emerging applications for UV LEDs drive broad interest (MAGAZINE)

Martin Shih reports that while technology barriers remain in manufacturing UV LEDs, especially at shorter wavelengths, a number of potential high-volume applications are driving interest among packaged LED manufacturers. The original version of this article can be...

IES explores luminuous flux maintenance projection method developments using LM-80 data

The IES is considering feedback from the LED industry on projection methods for testing and defining additional long-term behavior changes in LEDs that are not addressed in the current version of TM-21. Jianzhong Jiao describes possible models and updates under...

CSP LEDs crawl toward delivering on SSL promise (MAGAZINE)

Chip-scale packaging (CSP) technology has the potential to reduce LED component cost and provide SSL system-design advantages, explains Maury Wright, but the technology, borrowed from the mainstream semiconductor industry, has been slow to emerge commercially. The...