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CSP LEDs crawl toward delivering on SSL promise (MAGAZINE)

Chip-scale packaging (CSP) technology has the potential to reduce LED component cost and provide SSL system-design advantages, explains Maury Wright, but the technology, borrowed from the mainstream semiconductor industry, has been slow to emerge commercially. The...

Plessey announces silicon-LED case study, die, and filaments

GaN-on-Si specialist retrofits its Plymouth manufacturing facility with light engines based on its LEDs while also announcing new LED die products and filaments for retro-styled SSL lamps. The original version of this article can be found...

Good intentions yield LED standard for flicker, but questions remain (MAGAZINE)

The Institute of Electrical and Electronic Engineers (IEEE) has published a new LED standard that addresses flicker in solid-state ighting – defining safe levels of flicker by percentage relative to the operating frequency of a light source powered by the AC...

LED business news: Plessey gets UK grant, Everlight and Nichia continue IP battle

Plessey, Aixtron, and Bruker will use a UK grant to pursue GaN-on-Si LEDs on 200-mm substrates, while Nichia attacks Everlight in German Court, and Oxford Instruments announces PECVD sale to Chinese LED maker Enraytek. The original version of this article can be found...

LED business news: Dow Corning IP, new funding, and Eaton management

In the latest LED business developments, patented silicone encapsulants will improve LED light output, while Eaton shuffles management and Aledia gets major investment for 3-D silicon-based LEDs. The original version of this article can be found...